SPIE Advanced Lithography
When : 2017-02-26
Where : San Jose, California, United States
Submission Deadline : 2016-09-06
Categories : Digital Signal & Image Processing , Computer Science & Information Technology
SPIE Advanced Lithography
(AL series 2017)
26 February - 2 March 2017
San Jose, California, United States
Call For Papers
For over 40 years, the SPIE Advanced Lithography Symposium has played a key role in bringing together the microlithography communities involved with semiconductor devices, micro-/nano-systems, and related fields. Advances in traditional patterning together with the growth of alternative approaches drive the solutions of these demanding technologies. In the semiconductor field, the challenges of manufacturable, cost-effective lithography continue as patterning is extended further toward physical limits. State-of-the-art processes are being advanced through immersion lithography combined with multiple patterning and design co-optimization. Extreme UV lithography continues to move closer to volume production readiness, with a long string of successes along the way. And the lithography community is aggressively pursuing new patterning approaches to drive the implementation of complementary solutions. Success calls for unique interdisciplinary interactions and coordinated efforts between lithographers, layout designers, materials scientists, and metrology/process control engineers to enable cost efficient patterning solutions.
A full spectrum of lithography and patterning topics are encompassed by this year’s symposium across seven complementary conferences. Participants come from a broad array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials, etch, design, and process integration. Through a series of provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another. SPIE Advanced Lithography Symposium also provides the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields.This year, the SPIE Advanced Lithography Symposium is structured into the following conferences. All conferences are organized by current practitioners of the art working together with organizing committees of experts in these fields. Joint sessions between the conferences also offer opportunities to cover topics common across
these interest areas.
Emerging Patterning Technologies
– Extreme Ultraviolet Lithography
– Metrology, Inspection, and Process Control for Microlithography
– Advances in Patterning Materials and Processing Technology
– Optical Microlithography
– Design-Process-Technology Co-optimization for Manufacturability
– Advanced Etch Technology for NanopatterningWe welcome your participation for the 2017 SPIE Advanced Lithography Symposium and urge you to submit your abstracts to the appropriate conference as described in the Call for Papers, and be sure to tell your colleagues to do the same. Relevant topics for new technology groups, keynote talks, or panel discussions are also solicited.
Topics:
Conference topics for semiconductor lithography |
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| Click on the 2017 topics below to submit your paper: | ||
| • Extreme Ultraviolet (EUV) Lithography | ||
| • Emerging Patterning Technologies | ||
| • Metrology, Inspection, and Process Control for Microlithography | ||
| • Advances in Patterning Materials and Processes | ||
| • Optical Microlithography | ||
| • Design-Process-Technology Co-optimization for Manufacturability | ||
| • Advanced Etch Technology for Nanopatterning |
IMPORTANT DATES
- Abstracts Due: 6 September 2016
- Author Notification: 24 October 2016
- Manuscripts Due: 30 January 2016
