European Microelectronics and Packaging Conference & Exhibition
When : 2017-09-10
Where : Warsaw,Poland
Submission Deadline : 2017-03-31
Categories : Circuits , Wireless Sensor Networks
European Microelectronics and Packaging Conference & Exhibition(EMPC 2017)
September 10-13, 2017
Warsaw,Poland
Call For Papers
The forthcoming EMPC 2017 will build on the successful forerunning EMPCs – the latest were in Germany (2015) and France (2013) – to benefit exhibitors and technical contributors. EMPC brings together the entire microelectronics supply chain, technical and marketing professionals from around the world.
The International Microelectronics and Packaging Society (IMAPS) is a worldwide organization, which leads communication, education and interaction at all levels in the field. IMAPS is dedicated to the growth of the community focused on developments of microelectronics and packaging technologies of the present and future, including 3D Integration, SMT, CoB and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, Printed Electronics, MEMS, Photonics, HF, HT and Power-Electronics, Flexible Electronics, Advanced Materials, Thermal Management, Modeling/Design/Simulation, Reliability.
For the first time the conference is organized in eastern part of Europe. This gives an extra opportunity to bring together the entire microelectronics supply chain, technical and marketing professionals from all parts of Europe. The variety of sessions offers the possibility to enhance professional development, technical knowledge/skills and career progression. Furthermore, the industrial exhibition will highlight the latest products and service applications of value to the electronics community.
The conference is an important platform for dialogue between industry and academia. At EMPC 2017, we will provide you with an excellent technical programme of most recent research and development results worldwide.
Topics
- Advanced packaging and interconnects
- Electronics components assembly and PCB solutions
- Materials and processes
- Printed, hybrid and flexible electronics
- Modeling, design test & reliability
- Functional systems (actuators, sensors, photovoltaics and related)
Important Dates
- Submission Deadline : March 31, 2017
- Final Version Due : May 31, 2017
User Name : Claude
Posted 08-11-2016 on 08:29:42 AEDT