3rd International Conference on Sensors and Electronic Instrumentation Advances(SEIA 2017)

September 20-22, 2017

Moscow, Russia

Call For Papers

The 3rd International Conference on Sensors and Electronic Instrumentation Advances (SEIA' 2017) is a forum for presentation, discussion, and exchange of information and latest research and development results in both theoretical and experimental research in sensors, transducers and their related fields. It brings together researchers, developers, and practitioners from diverse fields including international scientists and engineers from academia, research institutes, and companies to present and discuss the latest results in the field of sensors and measurements. The 1st SEIA conference was held in Dubai (UAE), 21‐22 November 2015 and the 2nd - in Barcelona, Castelldefels (Spain), 22-23 September 2016.

The SEIA conference is focusing any significant breakthrough and innovation in Sensors, Electronics, Measuring Instrumentation and Transducers Engineering Advances and its applications with broadest concept. The conference is organized by the International Frequency Sensor Association (IFSA) and Asian Society of Applied Mathematics and Engineering (ASAME) in technical cooperation with National Research Center Kurchatov Institute and National Research Nuclear University (both from Moscow, Russia). IFSA is a non-profit association and is operated exclusively for educational, scientific and technical purposes for the benefit of the international sensor community.

Topics

• Accelerometers
• Inclinometers
• Gyroscopes
• Mechanical Sensors
• Optical Sensors
• Optical Fiber Sensors
• Photonic Sensors
• Chemical Sensors
• Biosensors
• Immunosensors
• BioMEMS
• Temperature Sensors
• Pressure Sensors
• Acoustic Sensors
• Electromagnetic Sensors
• Gas Sensors
• Humidity Sensors
• Infrared Sensors, Devices and Thermography
• Radiation Sensors
• Multi Sensor Fusion
• Smart Sensors
• Intelligent Sensors
• Virtual Sensors
• Sensor Interfacing and Signal Conditioning
• Sensor Calibration
• Nanomaterials and Electronics Technology for Sensors
• Semiconductor Materials for Sensors
• Polymer Materials for Sensors
• MEMS and NEMS
• Remote Sensors and Telemetry
• Sensor Applications

Important Dates

• Submission Deadline  : March 20, 2017
• Notification Due            : April 20, 2017
• Final Version Due          : June 30, 2017

User Name : Claude
Posted 08-11-2016 on 08:37:05 AEDT

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