IEEE Radio Frequency Integrated Circuits Symposium
(RFIC 2017)
June 4-6, 2017
Honolulu, Hawaii
Call for Paper
The 2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2017) will be held in Honolulu, HI, USA, on June 4-6, 2017. For the latest information
Topics of Interest
Wireless Cellular & Connectivity ICs: LTE/LTE-Advanced, 5G Massive MIMO, LTE-M, WWAN, WLAN, 802.11ax, Bluetooth, GPS Low Power Transceivers: IoT, RFID, NFC, Zigbee, WPAN, WBAN, Biomedical, Sensor Nodes RF Front-End ICs: LNAs, Mixers, Demodulators, VGAs, Filters, Phase shifters, switches, Full-duplex applications, and Interference cancellation Mixed-Signal RF and Analog Baseband Circuits: ADCs, DACs, Sub-sampling/Over- sampling Circuits, and analog baseband circuitry including filters and modulators Reconfigurable and Tunable Front-Ends: Cognitive Radio, Multi-mode advanced cellular radios, Digitallyassisted RF, and Re-configurable blocks (N-path filter, ADCs, tuners) Large-Signal Circuits: Power Amplifiers (RF & mm-Wave), Driver amplifiers, Advanced TX circuits, modulators, efficiency enhancement, and Linearization VCOs and Frequency Multipliers: RF and mm-Wave VCOs, Frequency Multipliers Frequency Generation Circuits: PLLs, Synthesizers, ADPLL, DDS, Frequency Dividers, DLL, and MDLL Modeling, CAD and Testing: RF Design Methodology, RF Modeling and CAD, EM Simulation, Co-Simulation, Testing and Analysis of Active/Passive Devices, and Built-in-Test Process, Device and Packaging Technologies: CMOS, SOI, SiGe, GaAs, GaN, MEMS, Integrated Passives, Photonic, Emerging Devices, Reliability, Packaging, and Modules mm-Wave Circuits & Systems: mmW SOCs and SIPs above 20GHz for data, video, and imaging, mmW frontend circuits, and mmW-based 5G systems
High-Speed Data Transceivers: Wireline, UWB, Optical Transceivers, and CDRs for High-Speed Data links
Important Dates:
Technical Paper Summaries in PDF format: 9 January 2017
Final Manuscripts for the Digest and USB: 16 March 2017
User Name : jerish
Posted 20-12-2016 on 12:28:20 AEDT