43rd European Solid-State Circuits Conference (ESSCIRC 2017)

Leuven, Belgium

September 11-14, 2017

Call for Papers :

The aim of ESSCIRC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The increasing level of integration for system-on-chip design made available by advances in semiconductor technology is, more than ever before, calling for a deeper interaction among technologists, device experts, IC designers and system designers.

Topics of Interest

• Analog
  OP-Amps and instrumentation amplifiers CT and DT filters; SC circuits, Comparators; Nonlinear circuits; Voltage and current references; HV circuits; Nonlinear analog circuits; Digitally assisted analog circuits
  

• Data Converters
  Nyquist-rate and oversampling A/D and D/A converters; Sample-hold circuits; Time-to-digital converters; ADC and DAC calibration/error correction circuits.
  

• RF and mm-Wave
  RF/IF building blocks like LNAs, mixers, power amplifiers, IF amplifiers; Power detectors; Subsystems for RF, mm-wave and THz design with focus on novel design techniques.
  

• Frequency Generation
  Modulators/demodulators; VCOs; PLLs; DLLs; Frequency synthesizers; Frequency dividers; Integrated passive component.
  

• Wireless and Wireline Systems
  Receivers/transmitters/transceivers for wireless/wireline systems Gigabit serial links; Clock and data recovery; Equalization; Advanced modulation systems; Base station and handset applications; TV/radio/satellite receivers and transmitters; Radars.
  

• Sensors, Imager and Biomedical
  Sensor subsystems and interfaces; Accelerometers; Temperature sensing; Imaging and smart imaging chips; AMOLED; MEMs subsystems; RF MEMs; Implantable electronic ICs; Biomedical imagers; Bio-MEMs integratedsystems; Labon-chip; Organic LED and liquid-crystal-display interface circuits; Flat panel and projection display.
  

• Digital, Security and Memory
  Techniques for energy efficient and high performance digital circuits; I/O and inter-chip communication; Reconfigurable digital circuits; Security and encryption circuits; Clocking; Arithmetic building blocks; Memories; Microprocessors; DSPs; Memory interfacing; Bus interfacing; Many core and multirate ICs; 3D integration.
  

• Power Management
  Energy transducers; Power regulators; DC-DC converters; Energy-scavenging circuits; LDOs Boost-buck-converters; LED drivers; Sequencers and supervisors; Green circuit.

Important Dates

• Paper Submission : April 10,2017
• Authors Notification : June 2,2017

User Name : jerish
Posted 27-12-2016 on 09:44:35 AEDT

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