IEEE Symposium in Low-Power and High-Speed Chips
When : 2017-04-19
Where : Yokohama
Submission Deadline : 2017-02-06
Categories : Electronics Engineering , Embedded Systems
IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS 17)
April 19-21, 2017, Yokohama
Call for Papers:
COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 20 is to be held in Yokohama on April 19-21, 2017, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. All papers will be published online via IEEE Xplore. From this year’s symposium, the COOL Chips Program Committee will ask the IEEE Transactions on Multi-Scale Computing Systems (TMSCS) to publish selected papers in a special issue on COOL Chips 20. Authors of industrial best papers will be recommended to submit an extended version to a COOL Chips special issue of IEEE Micro.
Contributions are solicited in the following areas:
- Low Power-High Performance Processors for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
- Novel Architectures and Schemes for Single Core, Multi/Many-Core, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and Wireless.
- Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Techniques.
Proposals should consist of a title, an extended abstract (up to 3 pages) describing the product or topic to be presented and the name, job title, address, phone number, FAX number, and e-mail address of the presenter. Please prepare the extended abstract using the given guidelines and template below.
Important Dates:
- February 6, 2017 Abstract Submission (through website)
- March 8, 2017 Acceptance Notified (by e-mail)
- March 31, 2017 Final Manuscript Submission
User Name : shaun
Posted 01-02-2017 on 20:30:58 AEDT