IEEE Third International Conference on Electrical and Electronic Engineering, Telecommunication Engineering, and Mechatronics (EEETEM2017)
April 26-28, 2017
Beirut, Lebanon
Call For Papers
The Third International Conference on Electrical and Electronic Engineering, Telecommunication Engineering, and Mechatronics (EEETEM2017) that will be held in Faculty of Engineering, Lebanese University, Campus of Hadath, Beirut, Lebanon on April 26-28, 2017. The event will be held over three days, with presentations delivered by researchers from the international community, including presentations from keynote speakers and state-of-the-art lectures.
Topics of Interest
Electronics Engineering
Artificial Intelligence
Bioinstrumentation: Sensors, Micro, Nano and Wearable Technologies
Circuits and Electronics
Communications and Networking
Computer Architecture for Intelligent Machines
Device Electronics for I.C
Electronic Medical Devices
Electronics & Nano Electronics
Electronics System-Level Based Design
FPGA and Reconfigurable Architecture based System
Fiber Optics and Fiber Devices
High Performance VLSI Systems
Integrated Optics
Intelligent Transportation Systems
Low-Power Signal Processing
Micro/Nano Systems and Networks
Mobile Computing
Multimedia Services and Technologies
Networks Design, Protocols and Management
Optical Electronic Devices & Photonics
Radio-Frequency Integrated Circuits
Robotic Systems
System on Chips and Network on Chips
Techniques of Laser and Applications Of Electro-optics
Electrical Engineering
Analog Circuits and Digital Circuits
Analysis of Power Quality and System Stability
Antenna and Propagation
Battery Management System
Bioinformatics & Biomedical Imaging
Biomedical Signal Processing
Brain-Computer Interfacing and Human–Computer Interfacing
Computer Relaying
Computer-Aided Surgery
Data Compression and Watermarking
Electric Energy Processing
Electro-optical Phenomena of Semiconductors
Electromagnetic and Photonics Expert Systems
Health Care Information Systems
Healthcare Information Systems, Telemedicine
Image Processing
Information Security and Cryptography
Integrated Optics and Electro-optics Devices
Internet and web solutions for healthcare
Microwave Theory and Techniques
Microwave and millimeter circuit and Antenna
Mobile Security
Modeling, Simulation, Systems and Control
Modulation, Coding, and Channel Analysis Multimedia Signal Processing
Natural Language Processing
Neural Networks
Parallel Programming & Processing
Power Electronics
Power IC Remote control and techniques of GPS
Robotics and Atomization Engineering
Signal Integrity Design for High-Speed Digital Systems
Signal Processing
Simulation of Propagation
Smart Grid
Speech Analysis and Synthesis
Speech Recognition
Wireless Communication
Mechatronics
Applications of AI Techniques in Design and Manufacturing
Diagnosis and Monitoring in Mechatronic Systems
Automation
Mechanical Engineering
Industrial Engineering
Micro-Machining
Instrumentation and Control
Mechatronics
Modeling and Design
Nano Technology
Robotics and Automation
Control, Robotics And Mechatronics
Robotics and Mobile Machines
Design and Manufacturing
Dynamic Systems and Control
Mechatronics and Intelligent Machines
Globalization of Engineering
Microsystems Integration
NanoEngineering for Energy
Nano and Micro Materials, Devices and Systems
Computer-aided design, manufacturing, and engineering
Fault detection and Diagnosis in Mechatronics Systems
Automobile technology
Autonomous Systems and Ambient Intelligence
Bio-Mechatronics
Machining
Design and Green Manufacturing
Intelligent Processing of Materials
Human-Machine Interface
Micro-electro Mechanical Systems and Devices
Micromachining and Microsystem technology
Micromechatronics
Important Dates
Submission deadline: Feb. 3, 2017.
Notification Due: March 3, 2017.
Final Version Due: March 31, 2017
User Name : Anika
Posted 26-11-2016 on 09:32:27 AEDT
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