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International Conference on Microelectronic Devices and Technologies

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When :  2022-09-21

Where :  Corfu, Greece

Submission Deadline :  2022-06-01

Categories :   Multimedia, Computer Graphics & Animation ,  Data Mining ,  Artificial Intelligence   

https://micdat-conference.com/

4th International Conference on Microelectronic Devices and Technologies (MicDAT '2022)

21-23 September 2022, Corfu, Greece

Call For Papers

The aim of MicDAT series of conference is to provide an annual world forum for the presentation and discussion of recent advances in microelectronics, and bring together leading international researchers, engineers and practitioners interested on any of the microelectronics related technologies. The conference will offer plenary and invited talks, contributed oral and poster presentations, special sessions, tutorials, and exhibitions of commercial products. Social and cultural events will also take place to foster networking among the participants in a friendly manner. The conference is coordinated with the IFSA series of conferences, which deal with physics and engineering.

Topics of interest include, but are not limited to, the following:

  • Analog, digital, mixed, and RF circuits and related design methodologies
  • Analog-to-Digital Converters (ADC)
  • Voltage-to-Frequency Converts (VFC)
  • Frequency-to-Digital Converters (FDC)
  • Time-to-Digital Converters (TDC)
  • vSemiconductor Devices: physics and technology
  • Circuit Theory and Applications
  • Active and Passive Electronic Components
  • Logic, architectural, and system level synthesis
  • Nonlinear circuits
  • Microprocessors, microcontrollers and DSPs
  • Testing, design for testability, built-in self-test
  • Area, power, and thermal analysis and design
  • Mixed-domain simulation and design
  • Embedded systems, low-power designs
  • VLSI Circuit and Systems design
  • Non-von Neumann computing and related technologies and circuits
  • Design and test of high complexity systems integration
  • SoC, MPSoC, NoC, SIP, and NIP design and test
  • Process technologies, CMOS, BJT, BiCMOS, GaAs
  • 3-D integration design and analysis
  • Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
  • Design for Manufacturability/Technology Optimization/Yield & Quality
  • Microelectronics processing and materials
  • Semiconductor processing
  • Modern electronics materials
  • Solid-state electronics
  • Quantum electronics
  • Thin solid films
  • Nanoprocessing, nanotechnology and nanofabrication​
  • Nanoelectronics and Spintronics
  • Flexible and stretchable electronics​
  • MEMS, MOEMS and NEMS
  • Computer-Aided Design (CAD) of Integrated Circuits
  • Hardware/software co-design
  • Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
  • Electronic materials science and technology
  • Electronics Cooling and Thermal Control
  • Optoelectronics
  • Organic electronic materials and devices
  • Microelectronics reliability and qualification
  • Assembly and Packaging

Paper Submission

All of accepted and registered papers will be published by IFSA Publishing, S.L. (Barcelona, Spain), which is a publisher of scientific and technical books and journal reaching around the globe to collect essential reference material and the latest advances and make them available to researchers, academics, professionals, and students in an accessible formats.

Important Dates

Submission Deadline:June 01, 2022
Authors Notification: June 20, 2022
Final Manuscript Due: July 30, 2022

User Name : tania
Posted 07-04-2022 on 15:55:12 AEDT


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