International Journal of Modelling, Simulation and Applications (IJMSA)
Scope and Topics
International Journal of Modeling, Simulation and Applications invites original papers in the research areas of modeling and simulations of various aspects of devices, analysis and implementation in digital and analog circuit applications. Prediction and optimization through modeling forms the basis of engineering design. A brief communication for rapid publication of short articles announcing significant and original results are also invited.
Topics of interest include but are not limited to, the following
- Design and Simulation of Devices and Circuits
- Modeling of Solid State Devices
- Organic/Polymer Electronics
- Pre- and Post-Fabrication/Processing of Data Analysis
- Modeling and Simulation of FinFETs, MOSFETs, CMOS, Tunnel-FETs
- Silicon Nanowires
- Simulation of Dual gate, Vertical Channel and Cylindrical Gate MOSFET/OTFTs
- Modeling of Circuit Networks, Analogue and Digital Circuits
- Modeling and Simulation p and n-Channel Organic Thin Film Transistors (OTFTs)
- Modeling and Simulation p and n-Polymer Thin Film Transistors (PTFTs)
- Modeling and Simulation Thin Film Transistors (TFTs)
- Modeling and Simulation Organic Novel Device Structures
- Modeling and Simulation of Novel Circuits
- Analytical Models for Organic Devices
- Mixed Mode Circuit Simulations
- Optimization of Device Performance Parameters
- Modeling and Simulation of Organic Light Emitting Diodes (OLEDs)
- Modelling and Simulation of Organic Solar Cells
- Novel Optoelectronic Devices
- Organic Device Applications
- Organic Electronic Emerging Technologies
- Modeling and Simulations Device Circuit Co-design
- Physics and Modeling of Submicron and Nanoscale Microelectronic and Optoelectronic Devices Including Processing, Measurement, and Performance evaluation
- Applications of Numerical Methods to the Modeling and Simulation of Devices and Processes
- Nanoscale Electronic and Optoelectronic Devices
- Photovoltaics and Sensors System Design
- Mathematical Models of Novel Electronic Device Structures
Paper Submission
Authors are invited to submit papers for this journal through E-mail: ijmsa.journal@yahoo.com or ijmsa@airccse.org. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.
Important Dates
| Submission Deadline | : | June 17, 2026 |
| Authors Notification | : | July 17, 2026 |
| Final Manuscript Due | : | July 24, 2026 |
| Publication Date | : | Determined by the Editor-in-Chief |
Editor in Chief
- Ashwani Rana, National Institute of Technology-Hamirpur, India
Editorial Board Members
- Ahmad Patooghy, Iran University of Science and Technology, Iran
- Daniel A.K, M.M.M University of Technology, India
- Balwinder Raj, National Institute of Technology-Jalandhar, India
- Bashiri, Hamedan University of Technology, Iran
- Candid Reig, University of Valencia, Spain
- Tarun K. Gupta, National Institute of Technology-Bhopal, India
- Brijesh Kumar, Graphic Era University, Dehradun
- Fei Yuan, Ryerson University, Canada
- Yasuhisa Omura, Kansai University, Japan
Building Knowledge That Resonates: AIRCC Achieves a 44.4% Citation Rate
For more than 17 years, the Academy and Industry Research Collaboration Center (AIRCC) has stood as a global, non profit research community dedicated to advancing knowledge without barriers. Founded by a group of visionary Computer Science & Engineering professors, AIRCC has grown into a multidisciplinary publishing hub that welcomes researchers from every corner of the world — without discrimination and without financial obstacles.
In the 2023–2024 publication cycle, AIRCC’s commitment to accessible, high quality research translated into remarkable scholarly impact:
• 1,333 total citations (2025)
• 1,562 total publications
• 693 cited publications
• 44.4% citation rate
• 0 self citations
• 0.85 average citations per publication
These numbers reflect more than academic performance — they represent trust. With zero self citations, AIRCC’s influence is driven entirely by genuine engagement from the global research community. Nearly half of all publications being cited underscores the relevance, visibility, and credibility of the work AIRCC supports.
At the heart of AIRCC’s mission is accessibility. Thousands of articles have been published free of cost or at minimal cost, with Article Processing Charges (APC) kept intentionally low. These fees cover only essential operational expenses, ensuring that researchers from all economic backgrounds can publish their work without financial strain. AIRCC’s model proves that high quality scholarly publishing does not need to be expensive — it needs to be inclusive.
AIRCC also thrives because of its community driven spirit. The organization warmly invites dedicated academicians with a service oriented mindset to join its mission. Volunteers can contribute as editors, editorial board members, or reviewers, helping shape the future of AIRCC’s journals and ensuring the continued publication of rigorous, impactful research. This is an opportunity to lead, mentor, and uplift the next generation of scholars.
AIRCC remains committed to bridging academia and industry, fostering collaboration, and empowering researchers worldwide. With a legacy built on integrity, inclusivity, and scholarly excellence, AIRCC continues to be a catalyst for global research advancement.
You can find the complete list of our journals at https://airccse.org/journal.html
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Posted 06-06-2026 on 16:16:43
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