26th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2027)

June 1-4, 2027, Denver, Colorado, USA

Scope & Topics

26th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2027) is a leading international conference for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.

ITherm 2027 brings together researchers, engineers, academics, industry professionals, and technology experts to discuss advances in thermal management, electronic packaging, cooling technologies, thermomechanical phenomena, reliability, emerging electronics, and data center thermal management.

ITherm 2027 will be held as an in-person conference along with the 77th IEEE Electronic Components and Technology Conference (ECTC). The conference will provide opportunities for technical presentations, keynote talks, vendor exhibits, panel discussions, invited technology talks, joint ECTC/ITherm networking events, short courses, and a student design competition.

Topics of Interest include, but are not limited to:

• Component-Level Thermal Management
• Advanced Packaging/HI Thermal Management
• Heat Pipes, Vapor Chambers and Thermosyphons
• Hotspot and Impingement Cooling
• Micro-gaps and Embedded Cooling
• Multi-scale, Multi-physics and Reduced Order Modeling
• RF and Power Electronics
• Single / Two-Phase Cold Plates and Heat Sinks
• Thermal Interface Materials and Heat Spreaders
• Thermal Management of Electric Machines
• Thermoelectric and Peltier Devices
• System-Level Thermal Management
• Advanced System Level Cooling Technologies
• Air Cooling Techniques and Heat Exchangers
• Aerospace Thermal Management
• Automotive, Batteries and Thermal Storage
• Cryogenics and Refrigeration
• Immersion Cooling
• Liquid Cooling Solutions
• System Integration and Optimization
• System Modeling and Digital Twins
• Transient Thermal Management
• Mechanics and Reliability
• Accelerated Testing and Lifetime Modeling
• Advanced Packaging/HI Mechanics and Reliability
• Materials and Characterization
• Mechanics in Assembly and Manufacturing
• Measurement of Deformations, Strains, and Stresses
• Thermo-Mechanical Modeling and Simulation
• Emerging Technologies and Fundamentals
• Additive Manufacturing and Topology Optimization
• Biomedical, Wearable, Flexible and Printed Electronics
• Boiling, Evaporation and Condensation
• Co-Packaged Optics, Near-Package Optics, and Lasers
• Device/System Technology Co-Optimization and Co-Design
• Measurement and Diagnostic Techniques
• Nanoscale Thermal Transport
• Next Generation and Harsh Environment Electronics
• Novel Materials and Fabrication Techniques
• Packaging and Interconnect Technologies
• Predictive Analytics, Machine Learning and AI
• Quantum and Photonic Computing
• Data Centers
• Air Cooling Methods
• Carbon Emissions and Sustainability
• Economics and Scaling
• Hybrid and Novel Cooling Methods
• Liquid Cooling Methods
• Modeling, AI/ML Techniques, Control and Optimization
• Performance Metrics, Standards and Regulatory Compliance
• Reliability and Failure Mitigation

Paper Submission

Researchers, academics, engineers, and industry professionals are invited to submit original research papers related to thermal management, thermomechanical phenomena, electronic packaging, cooling technologies, reliability, emerging electronic systems, data centers, and related areas.

ITherm 2027 requires submission of an abstract followed by a full paper. Abstracts are limited to 500 words and should contain no figures, tables, or graphs. Submitted papers will undergo peer review and accepted papers will be published in the IEEE Xplore ITherm proceedings.

Authors may submit work covering new research findings, innovative thermal management techniques, experimental investigations, modeling and simulation, system designs, reliability studies, emerging technologies, and practical applications.

Conference Program

ITherm 2027 will include technical sessions covering component-level thermal management, system-level thermal management, mechanics and reliability, emerging technologies and fundamentals, and data center thermal management.

The conference will also feature keynote talks, vendor exhibits, panel discussions, invited technology talks, ECTC/ITherm joint networking events, short courses, and a student design competition.

ITherm 2027 will be held in person along with the 77th IEEE Electronic Components and Technology Conference (ECTC), providing opportunities for researchers, students, industry professionals, and practitioners to exchange ideas and discuss the latest developments in electronic thermal and thermomechanical technologies.

Important Dates

Abstract Submission	:	September 28, 2026
Notification to Authors	:	October 26, 2026
Draft Paper Submission	:	January 4, 2027
Reviews Returned	:	February 8, 2027
Final Paper Submission	:	March 8, 2027
Conference Date	:	June 1-4, 2027

Conference Chairs

User Name : dominica
Posted 25-08-2026 on 17:46:38

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