2026 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

October 18-21, 2026, Fort Worth, Texas, USA

Scope & Topics

2026 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) is an international conference dedicated to the electrical performance of electronic packaging and systems.

EPEPS provides a forum for researchers, engineers, industry professionals, educators, and students to present and discuss the latest developments in electrical design, analysis, modeling, measurement, and optimization of electronic packages, interconnects, and systems.

The conference brings together experts working in signal integrity, power integrity, high-speed interconnects, advanced and heterogeneous packaging, 3D integration, modeling and simulation, measurement, and emerging applications of artificial intelligence and machine learning in electronic packaging and systems.

Topics of Interest include, but are not limited to:

• Signal Integrity
• Power Integrity
• High-Speed Digital Systems
• High-Speed Interconnects
• Electronic Package Design
• Advanced Electronic Packaging
• Heterogeneous Integration
• 3D Integration and 3D Packaging
• Chiplet Integration
• System-in-Package Technologies
• Interconnect Modeling
• Electrical Performance of Packages and Systems
• Power Distribution Networks
• Electromagnetic Compatibility
• Electromagnetic Interference
• RF and Microwave Packaging
• High-Frequency Electronics
• Optical and Electrical Interconnects
• Advanced Substrates and Interposers
• Package and Board-Level Interconnects
• Modeling and Simulation
• Numerical Methods and Computational Techniques
• Measurement and Characterization
• Design Automation
• System-Level Analysis
• Thermal and Electrical Co-Design
• Manufacturing and Test Technologies
• Reliability of Electronic Systems
• Machine Learning Applications
• Artificial Intelligence for Electronic Design
• Data-Driven Modeling
• Emerging Electronic Packaging Technologies
• Next-Generation Electronic Systems

Paper Submission

Researchers, engineers, students, educators, and industry professionals are invited to submit original technical papers describing new research results, innovative technologies, practical applications, experimental studies, modeling techniques, and developments related to the electrical performance of electronic packaging and systems.

Submitted papers should present original and significant technical contributions relevant to the conference scope. Contributions may address theoretical analysis, simulation, measurement, design methodologies, experimental validation, and practical applications.

All submitted papers will be reviewed by experts in the relevant technical areas. Accepted papers will form part of the technical program of the conference.

Conference Program

The technical program of EPEPS 2026 will feature presentations and discussions covering advances in electronic packaging, high-speed systems, signal and power integrity, interconnect technologies, modeling, simulation, measurement, and emerging technologies.

The conference provides opportunities for researchers and industry professionals to exchange ideas, discuss current challenges, explore future research directions, and establish collaborations in the field of electronic packaging and system design.

Important Dates

Paper Submission Deadline	:	July 22, 2026
Author Notification	:	To Be Announced
Final Paper Submission	:	To Be Announced
Conference Date	:	October 18-21, 2026

Conference Website

https://www.epeps.org/

User Name : laura
Posted 27-08-2026 on 22:15:23

Related CFPs

MLAIJ   Machine Learning and Applications: An International Journal

IEIJ   Informatics Engineering, an International Journal (IEIJ)

IWMEN 2026   11th International Conference on Intelligent Wireless, Mobile and Edge Networks (IWMEN 2026)

SOEN 2026   11th International Conference on Software Engineering (SOEN 2026)

CSIA 2026   17th International Conference on Communications Security & Information Assurance