The 3rd Int'l Conference on Microwave and Terahertz Technology
When : 2018-01-05
Where : Bangkok, Thailand
Submission Deadline : 2017-11-30
Categories : Digital Signal & Image Processing , Soft Computing
The 3rd Int'l Conference on Microwave and Terahertz Technology (ICMTT 2018) will be held from January 5-7, 2018 in Bangkok, Thailand. ICMTT 2018 is sponsored by Engineering Information Institute, Open Access Library, Scientific Research Publishing, and 1000thinktank. This Conference will cover issues on Microwave and Terahertz Technology. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods.
Invited Speakers
Publication and Presentation
All the accepted papers will be published by "Journal of Computer and Communications" (ISSN:2327-5219), a peer-reviewed open access journal that can ensure the widest dissemination of your published work. For more information, please visit: http://www.scirp.org/journal/jcc/.
You can submit your papers/abstract through Registration System.
Registration Fee
| Package A: | Regular Attendance (No Submission Required) | USD 400(RMB 2400) |
| Package B: | Regular Attendance+Abstract+Presentation | USD 450(RMB 2700) |
| Package C: | Regular Attendance+Paper Publication+Presentation | USD 600(RMB 3600) |
The Regular Registration Fee for attendance Includes
1. Access to all technical sessions
2. Lunch on January 6 and 7, dinner on January 6
3. Coffee breaks during the sessions
4. One hard copy of the conference guide and Journal
Contact Us
Contact Person: Ms Rolin
Email: comm_mar@engii.org
Tel: +86 150 7134 3477
QQ: 3025797047
WeChat: Engii_hw
For urgent issue, please contact Rolinrolin@126.com
Conference Topics
Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest:
Microwave Field and Techniques
Field Analysis and Guided Waves
Frequency-Domain EM Analysis Techniques
Time-Domain EM Analysis Techniques
CAD Algorithms and Techniques
Linear Device Modeling
Nonlinear Device Modeling
Nonlinear Circuit and System Simulation
Microwave Passive Components
Transmission Line Elements
Passive Circuit Elements
Planar Passive Filters and Multiplexers
Non-planar Passive Filters and Multiplexers
Active, Tunable and Integrated Filters
Ferroelectric, Ferrite and Acoustic Wave Components
MEMS Components and Technologies
Microwave Active Components
Semiconductor Devices and Monolithic ICs
Signal Generation
Frequency Conversion and Control
HF, VHF and UHF Technologies and Applications
Power Amplifier Devices and Circuits
High-Power Amplifiers
Low Noise Components and Receivers
Mm-Wave and THz Components and Technologies
Microwave Systems and Applications
Microwave Photonics
Mixed Mode and Digital Signal Processing Circuits and Systems
Packaging, Interconnects, MCMs and Integration
Instrumentation and Measurement Techniques
Biological Effects and Medical Applications
Arrays as Antennas and Power Combiners
Radar and Broadband Communication Systems
Wireless and Cellular Communication Systems
Sensors and Sensor Systems
RFID Technologies
High Power Microwave Industrial Applications
Emerging Technical Areas of Microwave
RF Nanotechnology
Wireless Power Transmission
New Technologies and Applications
Innovative Systems
Microwave/RF Devices for Wireless Health Care Applications
Terahertz Theory and Technology
Terahertz Devices: Electronics/Photonics/Plasmonics
Terahertz Generation, Propagation, and Interaction
Passive Components and Materials Issues in Terahertz
Terahertz Imaging
Terahertz Sources, Detectors and Receivers
Terahertz System Architectures and Distributed Networks
Terahertz Diagnostics
Terahertz Nanoelectronics
Terahertz Spectroscopy
Terahertz Systems
Advanced Materials and Concepts (E.G., Metamaterials, Memristor)
Novel Concepts (E.G., Plasmonic THz, Quantum Cascade Lasers)
Terahertz to Optical Metamaterials, Assemblies, and Systems
New Frontiers and Recent Breakthroughs in Terahertz Research
Novel Applications of Terahertz
VLSI Trustworthiness and Inspection – Counterfeit IC Detection
Industrial Inspection
Security and Military
Biomedical
Information Processing and Computing
Electronics/Information/Communication Systems
Integration of Advanced Materials with Conventional Devices and Systems
User Name : Engii
Posted 20-10-2017 on 14:35:20 AEDT
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