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2nd International Conference on Microelectronic Devices and Technologies

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When :  2019-05-15

Where :  Amsterdam, The Netherlands

Submission Deadline :  2019-01-30

Categories :   Electronics Engineering ,  Digital Signal & Image Processing ,  Electrical Engineering   

http://www.micdat-conference.com/

2nd International Conference on Microelectronic Devices and Technologies(MicDAT 2019)

May 15-17, 2019, Amsterdam, The Netherlands

Scope & Topics

8th International Conference on Information Technology Convergence and Services (ITCSE 2019) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of Information Technology Convergence and Services. The aim of the conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet and share cutting-edge development in the field. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to.

Topics of Interest :

  • Analog, digital, mixed, and RF circuits and related design methodologies
  • Analog-to-Digital Converters (ADC)
  • Voltage-to-Frequency Converts (VFC)
  • Frequency-to-Digital Converters (FDC)
  • Time-to-Digital Converters (TDC)
  • Logic, architectural, and system level synthesis
  • Nonlinear circuits
  • Microprocessors, microcontrollers and DSPs
  • Testing, design for testability, built-in self-test
  • Area, power, and thermal analysis and design
  • Mixed-domain simulation and design
  • Embedded systems, low-power designs
  • VLSI systems circuit and design
  • Non-von Neumann computing and related technologies and circuits
  • Design and test of high complexity systems integration
  • SoC, MPSoC, NoC, SIP, and NIP design and test
  • Process technologies, CMOS, BJT, BiCMOS, GaAs
  • 3-D integration design and analysis
  • Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
  • Design for Manufacturability/Technology Optimization/Yield & Quality
  • Microelectronics processing and materials
  • Semiconductor processing
  • Modern electronics materials
  • Solid-state electronics
  • Quantum electronics
  • Thin solid films
  • Nanoprocessing, nanotechnology and nanofabrication​
  • Flexible and stretchable electronics​
  • MEMS and NEMS
  • CAD tools for microelectronics
  • Hardware/software co-design
  • Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
  • Electronic materials science and technology
  • Organic electronic materials and devices
  • Microelectronics reliability and qualification
  • Assembly and Packaging

Important Dates :

Submission Deadline: January 30, 2019
Authors Notification: February 28, 2019
Registration & Camera-Ready Paper Due : April 10, 2019

 

User Name : mark
Posted 23-11-2018 on 23:44:18 AEDT


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