XXX International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2023)

November 02-04, 2023, Lima, peru

Scope & Topics

XXX International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2023) INTERCON (IEEE Peru Section conference) is a renowned IEEE international technical conference which has been conducted in the Peru Section, to bring exciting discoveries, knowledge & understanding together. INTERCON 2023 is the XXX version of the conference and has been themed inspired by the IEEE Future Directions platforms. Year 2023’s INTERCON is co-organized by UPC (Universidad de Ciencias Aplicadas) jointly to its IEEE UPC Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2023 will continue the footsteps of its predecessors, to serve as a great platform for researchers to discuss and explore advanced technologies in advancing humanity. In addition to the traditional topic areas of INTERCON 2023 listed below, papers are also solicited for a new track on “IoT and Smart Systems”.

Topics of Interest :

• Artificial Intelligence and Machine learning
• Communications and Networking
• Power, Energy, and Power Electronics
• Biomedical Engineering and Healthcare Technologies
• Robotics, Control, Instrumentation, and Automation
• Multimedia Signal Processing and Analytics
• Devices, Circuits, and Materials
• RF Circuits, Systems, and Antennas
• Data Science and Computing Technologies
• Education in Engineering and Technology

  Paper Submission

  Submit your contributions to Electronic Submission System; ( .pdf only).
  
  Note: If you are interested in special sessions, after submission via system, please mail this to informes@ieee.org.pe

  Important Dates

  Submission Deadline	:	July 31, 2023
  Authors Notification	:	September 15, 2023
  Final Manuscript Due	:	October 05, 2023