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12th International Conference on Circuits and Systems (CIRSY 2026)

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When :  2026-06-20

Where :  Sydney, Australia

Submission Deadline :  2026-05-02

Categories :   Circuits ,  Networks & Communications ,  Digital Signal & Image Processing ,  Wireless Sensor Networks

https://cirsy2026.org/index

12th International Conference on Circuits and Systems (CIRSY 2026)

June 20 ~ 21, 2026, Sydney, Australia

Scope & Topics

12th International Conference on Circuits and Systems (CIRSY 2026)is a premier forum dedicated to advancing research, innovation and collaboration in the broad field of circuits and systems. As technology continues to evolve at an unprecedented pace, CIRSY 2026 aims to bring together leading researchers, academics, industry experts and practitioners to share breakthroughs, discuss emerging challenges and explore future directions in electronic design and system level integration.

The conference provides a dynamic platform for presenting original research contributions spanning analog, digital, mixed signal, RF, VLSI, embedded systems, photonics, power electronics, AI hardware, chiplet based architectures and many other cutting edge domains. By fostering interaction between academia and industry, CIRSY 2026 encourages the exchange of ideas that drive technological progress and support the development of next generation electronic systems.

Only original, unpublished research papers are invited for submission. Through high quality presentations, discussions and networking opportunities, CIRSY 2026 seeks to inspire innovation and strengthen the global circuits and systems community.

Topics of interest include, but are not limited to, the following

    Advanced Circuits, Devices and Emerging Technologies
  • Beyond CMOS Devices (spintronics, memristors, ferroelectric FETs)
  • Neuromorphic and Brain Inspired Circuits
  • In Memory and Near Memory Computing
  • AI Native Analog Computing & Mixed Signal AI Engines
  • Quantum Circuits, Cryogenic Electronics and Qubit Control
  • 3D/2.5D Integration, Chiplets, UCIe Based Systems and Heterogeneous Packaging
  • Novel Interconnects, High Bandwidth Interfaces and Photonic Electrical Co Design
  • Analog, Mixed Signal, RF and mmWave Circuits
  • High Performance Analog and Mixed Signal ICs
  • RF, mmWave and THz Circuits for 5G/6G
  • Reconfigurable Intelligent Surfaces (RIS) Hardware
  • Low Power Analog Front Ends and Sensor Interfaces
  • High Speed Data Converters and Clocking Systems
  • Integrated Power Amplifiers, Oscillators and Frequency Synthesizers
  • Digital Circuits, VLSI and System on Chip Design
  • Digital IC Design and Optimization
  • VLSI Systems, SoC/NoC Architectures
  • RISC V Architectures, Extensions and Open Source Silicon
  • Low Power, Thermal Aware and Energy Efficient Design
  • Hardware/Software Co Design and Co Verification
  • FPGA Based Systems and Reconfigurable Architectures
  • Circuits and Systems for AI, ML and High Performance Computing
  • AI/ML Accelerators (DNN, LLM, transformer, diffusion and generative AI hardware)
  • Memory Centric and Bandwidth Optimized AI Architectures
  • Analog and Mixed Signal AI Accelerators
  • Edge AI, TinyML and Always On Intelligence
  • Hardware for HPC, Cloud and Data Center Workloads
  • Vision, Imaging and Real Time Perception Hardware
  • Hardware Security, Trust and Post Quantum Protection
  • Secure Hardware Architectures and Trusted Computing
  • PUFs, Anti Tampering and Side Channel Attack Mitigation
  • Hardware Trojans and Supply Chain Security
  • Post Quantum Cryptographic Accelerators
  • Zero Trust Hardware Architectures
  • Secure Chiplet Interconnects and Multi Die Security
  • Photonic, Optoelectronic and Quantum Systems
  • Silicon Photonics and Integrated Optical Circuits
  • Photonic Neural Networks and Optical Computing
  • Optical Interconnects for HPC and Data Centers
  • Quantum Photonic Circuits and Cryogenic Readout Systems
  • Power Electronics, Energy Systems and Sustainable Circuits
  • Power Management ICs and High Efficiency Converters
  • GaN/SiC Power Devices and Automotive Power Electronics
  • Wireless Power Transfer and Energy Harvesting
  • Circuits for Renewable Energy and Smart Grids
  • Sustainable IC Design and Carbon Aware Architectures
  • Eco Friendly Materials and Sustainable Semiconductor Manufacturing
  • Sensors, Sensing Systems, IoT and Cyber Physical Systems
  • Intelligent Sensor Interfaces and Edge Processing
  • Ultra Low Power IoT Hardware and Battery less Systems
  • Cyber Physical Systems and Smart City Electronics
  • Environmental, Industrial and Biomedical Sensing
  • Joint Communication Sensing Hardware for 6G
  • Robotics, Autonomous Systems and Real Time Hardware
  • Real Time Perception and Control Circuits
  • Low Latency Embedded Systems for Robotics and Drones
  • Safety Critical and Mission Critical Hardware
  • Autonomous Navigation and Sensor Fusion Hardware
  • Biomedical and Bio Inspired Circuits and Systems
  • Wearable and Implantable Medical Devices
  • Neural Interfaces, Brain Machine Circuits and Bio Signal Processing
  • Lab on Chip, Bio MEMS and Point of Care Systems
  • Bio Inspired Computing and Adaptive Systems
  • EDA, Modeling, Simulation and Verification
  • AI Driven EDA (ML based P&R, analog automation, RL based optimization)
  • LLM Based Hardware Design Automation & Autonomous Chip Design Agents
  • System Level Modeling and Hardware Emulation
  • Formal Verification and Design Validation
  • Fast Analog/Mixed Signal Simulation
  • Digital Twins for Circuits, Systems and Semiconductor Manufacturing
  • Nonlinear, Neural and Complex Dynamical Systems
  • Nonlinear Circuits and Chaos Based Systems
  • Adaptive and Self Organizing Circuits
  • Complex Networks and Dynamical System Modeling

Paper Submission

Authors are invited to submit papers through the conference Submission System by May 02, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Electronics Engineering: An International Journal (ELELIJ)(Confirmed).

Selected papers from CIRSY 2026, after further revisions, will be published in the special issue of the following journals.


  • Circuits and Systems: An International Journal (CSIJ)

Important Dates

Submission Deadline: May 02, 2026
Authors Notification: May 23, 2026
Final Manuscript Due: May 30, 2026

Co - Located Event

  • 10th International Conference on Civil Engineering (CE 2026)
  • 10th International Conference on Advances in Engineering (AE 2026)
  • 11thInternational Conference on Mechanical Engineering (ME 2026)

***** The invited talk proposals can be submitted to cirsy@ccnet2026.org


User Name : shira
Posted 22-04-2023 on 17:33:20 AEDT


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