IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2026)
IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2026) brings together researchers, engineers, scientists and industry professionals to present the latest developments in flexible electronics, printable sensors and emerging intelligent systems. The conference provides a platform for sharing innovative research findings, new materials, fabrication technologies and applications in flexible and stretchable electronics, wearable systems, IoT devices and smart technologies.
Authors are invited to submit original unpublished research papers through the IEEE FLEPS 2026 submission system. Papers should present innovative research results and must not have been published previously or be under consideration elsewhere.
Submission Link : IEEE FLEPS 2026 Submission System
| Option B Submission Deadline | : | March 01, 2026 |
| Option A Submission Deadline | : | March 23, 2026 |
| Notification of Acceptance | : | May 04, 2026 |
| Final Manuscript Submission | : | May 25, 2026 |
| Conference Date | : | July 12 - 15, 2026 |
Accepted papers will be published in IEEE FLEPS conference proceedings and submitted for inclusion in IEEE Xplore Digital Library.
For IEEE FLEPS 2026 inquiries related to conference information, paper submission details, registration, participation and other conference-related queries, please contact the organizing team.
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Posted 01-07-2026 on 16:28:21