IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE 2026)

October 27 - 29, 2026 | Phoenix, USA

The IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE 2026) is an international forum for researchers, engineers, industry professionals and government organizations working in hardware security, electronics assurance and trusted microelectronics. The conference provides opportunities to present recent advances in physical inspection, supply chain assurance, semiconductor security and emerging technologies for trustworthy electronic systems.

PAINE 2026 welcomes original research contributions that address innovative techniques, methodologies and practical solutions for hardware assurance, secure electronics and advanced inspection technologies.

Topics of interest include but are not limited to, the following

• Hardware Security and Trust
• Physical Assurance of Electronics
• Advanced Packaging and Heterogeneous Integration
• Image Analysis and Artificial Intelligence for Inspection
• Automated Inspection and Metrology
• Supply Chain Security
• Counterfeit Detection Techniques
• Fault Injection Assessment
• Side Channel Analysis
• FPGA Security and Bitstream Protection
• Physical Fingerprinting Techniques
• Analog and Mixed Signal Security
• PCB Trust and Assurance
• Novel Security Devices and Materials
• Failure Analysis and Fault Isolation
• Tamper Detection and Countermeasures
• Photonics Assurance
• Hardware Trojan Detection

Paper Submission

Authors are invited to submit original unpublished papers in standard IEEE two-column format through the PAINE 2026 EasyChair submission system. Accepted papers presented at the conference will be submitted for publication in the IEEE Xplore Digital Library.

Submission Link : PAINE 2026 EasyChair Submission System

Important Dates

Publication

Accepted papers presented at PAINE 2026 will be submitted for publication in the IEEE Xplore Digital Library, subject to IEEE publication requirements.

Contact Us

For inquiries regarding PAINE 2026, including paper submission, registration, participation and conference information, please contact the organizing committee.

• PAINE 2026 Organizing Committee
• Email : nasadi@ufl.edu
• Website : https://paine-conference.org/