2027 IEEE 27th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2027)

January 17–20, 2027 | Tampa, Florida, USA

Call for Papers

The 2027 IEEE 27th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2027) will bring together researchers, engineers, and industry professionals working on silicon technologies for radio frequency (RF), millimeter-wave, and terahertz (THz) applications.

Marking its 27th edition, SiRF 2027 highlights advances in RF CMOS and SiGe BiCMOS technologies, with renewed emphasis on artificial intelligence and quantum technologies. The conference provides an interactive forum for integrated circuit designers and researchers to exchange ideas on emerging RF and microwave systems, silicon-based hardware, and next-generation communication technologies.

SiRF 2027 is part of IEEE Radio & Wireless Week (RWW 2027), which brings together several specialized conferences and technical events in radio frequency, microwave, wireless communication, sensing, and related technologies.

Topics of Interest

SiRF 2027 invites original research papers in the following focus areas:

• AI and Quantum Computing for Emerging RF and Microwave Systems
  • AI-Assisted and AI-Enabled RF/mm-Wave/THz Integrated Circuits
  • ML-Based Built-In Self-Test (BIST), Calibration, and Adaptation
  • Cryogenic RF and Microwave Integrated Circuits for Quantum Computing
  • Silicon-Based Spin Qubit Control and Readout Electronics
• RF, Millimeter-Wave, and THz Integrated Circuits
  • Integrated Circuits for B5G/6G Wireless Communication and Sensing Systems
  • Multi-Band, Ultra-Wideband, and Reconfigurable RF Front-Ends and Transceivers
  • Oscillators, PLLs, and Frequency Synthesizers
  • Frequency Converters, Modulators, Phase Shifters, and Multi-Throw Switches
• High-Speed ASICs for Wireline and Optical Communications
  • Broadband Wireline/Optical Transmitters, Receivers, and Transceivers
  • High-Speed/Broadband Front-Ends (TIA, Driver)
  • Advanced Techniques for Equalization and Clock and Data Recovery (CDR)
  • Silicon Photonics and Co-Packaged Optics (CPO)
• Device Technologies, Advanced Packaging, and Heterogeneous Integration
  • Advanced Bulk CMOS, SOI CMOS, FinFET, and SiGe BiCMOS Technology and Device Modeling
  • 2.5D/3D IC Packaging and System-in-Package (SiP) Technologies
  • Advanced Heterogeneous Integration Techniques
  • Advanced High-Frequency Measurement and Characterization Techniques

Paper Submission

Authors are invited to submit original research papers relevant to the conference focus areas. Manuscripts must follow the modified IEEE Conference Manuscript Template and be written in English. Paper summaries must not exceed four pages and should be submitted in PDF format.

During submission, authors should provide the paper title, a short abstract, preferred presentation format (oral or poster), topical category, and author information. Submissions will be evaluated based on novelty, significance, technical content, audience interest, and quality of writing.

Submission Guidelines: Author Information and Submission Guidelines

Paper Submission: IEEE Radio & Wireless Week Website

Publication

All accepted papers will be published in the conference digest. Papers presented at the conference will be included in the IEEE Xplore Digital Library, subject to the applicable IEEE publication requirements. At least one author of an accepted paper must complete full conference registration and present the work.

Important Dates

Paper Submission Deadline: July 22, 2026
Conference Dates: January 17–20, 2027

Please refer to the official Radio & Wireless Week author information page for the general paper-handling timeline, including notification and final manuscript dates.

Co-Located Conferences

• IEEE Radio and Wireless Symposium (RWS)
• IEEE Topical Conference on RF/Microwave Power Amplifiers for Radio and Wireless Applications (PAWR)
• IEEE Topical Conference on Wireless Sensors and Sensor Networks (WiSNet)
• IEEE Space Hardware and Radio Conference (SHaRC)

Contact

For questions regarding paper submission, authors are advised to contact the SiRF Technical Program Chair through the IEEE Radio & Wireless Week organizing team.

Website: https://www.radiowirelessweek.org/conferences/sirf/