2027 IEEE 77th Electronic Components and Technology Conference (ECTC)

June 1-4, 2027, Denver, Colorado, USA

Scope & Topics

2027 IEEE 77th Electronic Components and Technology Conference (ECTC) is a premier international conference that brings together researchers, engineers, industry professionals, educators, and technology experts working in electronic packaging, components, and microelectronic systems.

ECTC provides a platform for sharing the latest research, technologies, and practical developments in electronic components, advanced packaging, semiconductor systems, and related areas. The conference encourages technical exchange and collaboration between researchers, industry professionals, and academic institutions.

The conference covers a wide range of topics related to microelectronics packaging, system integration, advanced materials, components, manufacturing, reliability, and emerging technologies shaping the future of electronic systems.

Topics of Interest include, but are not limited to:

• Advanced Electronic Packaging
• Semiconductor Packaging
• Microelectronics Packaging
• Electronic Components
• System Integration
• Advanced Packaging Technologies
• Chiplet Integration
• Heterogeneous Integration
• 3D Integration and 3D Packaging
• 2.5D Packaging
• Fan-Out and Fan-In Packaging
• Wafer-Level Packaging
• Panel-Level Packaging
• Advanced Substrates
• Organic Substrates
• Interposers and Package Substrates
• High-Density Interconnects
• Electrical and Optical Interconnects
• High-Speed Interconnects
• Thermal Management
• Heat Dissipation and Cooling Technologies
• Power Electronics Packaging
• RF and Microwave Packaging
• Photonics Packaging
• Optoelectronic Packaging
• MEMS and Sensor Packaging
• Flexible and Wearable Electronics
• Advanced Materials for Electronic Packaging
• Packaging Materials and Processes
• Assembly and Manufacturing Technologies
• Reliability and Failure Analysis
• Mechanical Reliability
• Thermal Reliability
• Electrical Reliability
• Testing and Characterization
• Simulation and Modeling
• Design and Manufacturing Automation
• Artificial Intelligence in Electronics Packaging
• Machine Learning Applications
• High-Performance Computing Packaging
• Data Center and AI System Packaging
• Quantum Computing Packaging
• Automotive Electronics
• Power and Energy Applications
• Medical and Biomedical Electronics
• Emerging Electronic Technologies
• Next-Generation Microelectronic Systems

Paper Submission

Researchers, engineers, students, and industry professionals are invited to submit original technical work for presentation at ECTC. Contributions may cover new research findings, innovative technologies, practical applications, experimental studies, manufacturing processes, and developments in electronic components, packaging, and microelectronic systems.

Submitted work should provide new technical contributions and be relevant to the conference scope. Selected contributions will be reviewed as part of the conference's technical program.

Conference Program

The conference will feature technical presentations covering the latest developments in electronic components, advanced packaging, microelectronics, and system integration. ECTC also provides opportunities for researchers and industry professionals to exchange ideas, discuss emerging technologies, and build professional connections.

The event will also include exhibitors and other activities that allow attendees to learn about new equipment, materials, technologies, and services used across the electronics and semiconductor industries.

Important Dates

Conference Information

User Name : Sophia
Posted 25-08-2026 on 03:31:26

Related CFPs