2027 IEEE International Reliability Physics Symposium (IRPS 2027)

March 21 ~ 25, 2027, San Diego, California, USA

Scope & Topics

2027 IEEE International Reliability Physics Symposium (IRPS 2027) is the premier international conference for engineers and scientists to present new and original work in the area of microelectronics reliability. The symposium brings together researchers, engineers, and industry professionals from around the world to discuss the reliability of semiconductor devices, integrated circuits, electronic materials, and microelectronic assemblies. IRPS provides an international forum for sharing advances in reliability physics, failure mechanisms, device characterization, reliability testing, and emerging semiconductor technologies.

IRPS 2027 focuses on the understanding of the physics of failure, reliability modeling, device degradation, and the impact of application environments on electronic and optoelectronic systems.

Researchers are invited to contribute original research covering theoretical, experimental, and practical developments in microelectronics reliability.

Topics of interest include, but are not limited to, the following

• Circuit Reliability and Aging
• Dielectrics Reliability
• Emerging Memory Technologies
• ESD and Latchup
• Failure Analysis
• GaN Devices and SiC Devices
• Memory Reliability
• Metallization and BEOL Reliability
• Neuromorphic Computing Reliability
• Packaging and 2.5D/3D Assembly
• Process Integration
• Product Reliability
• Radiation Effects Reliability
• Reliability Testing
• RF/mmW/5G Reliability
• Silicon Photonics and Co-Packaged Optics
• System Electronics Reliability
• Transistor Reliability
• Advanced Semiconductor Materials
• 2D Transition Metal Dichalcogenides
• Semiconducting Oxides and Ferroelectric Materials
• Low-k Dielectrics and Capacitor Reliability
• Datacenter and AI System Reliability
• High Performance Computing Reliability
• Silent Data Errors and Reliability at Scale
• AI and HPC Workload Reliability
• On-Chip Telemetry and Thermal Reliability
• Optical Interconnect Reliability
• Advanced Memory Integration
• High-Bandwidth Memory Reliability
• Compute-in-Memory Reliability
• Reliability Modeling and Simulation
• Device Degradation and Failure Mechanisms
• Electromigration and Joule Heating
• Bias Temperature Instability (BTI)
• Hot Carrier Injection (HCI)
• Time Dependent Dielectric Breakdown (TDDB)
• Radiation Effects in Electronic Devices
• Reliability of Advanced Integrated Circuits
• Emerging Semiconductor Technologies

Paper Submission

Authors are invited to submit their original two-page abstracts through the conference submission system. Abstract Submission System by October 18, 2026 . All abstracts must be submitted electronically in PDF format. Abstracts should highlight the novelty of the research and provide specific results to demonstrate the significance of the work. Following abstract review, accepted authors will be invited to submit their full-length manuscripts before the conference. For complete submission guidelines, please visit the official conference website.

Call for Papers and Submission Guidelines

Selected and accepted papers will be included in the IRPS conference proceedings. Further publication information is available through the official conference website.

Important Dates

Abstract Submission Deadline : October 18, 2026
Authors Notification : December 18, 2026
Late News Submission Deadline : January 18, 2027
Final Manuscript Due : January 29, 2027
Conference Dates : March 21 ~ 25, 2027

Conference Venue

Town and Country Resort San Diego, California, USA
Official Conference Website

Contact Us

For further information regarding IRPS 2027, please contact:

t.holle@ieee.org

https://www.irps.org/