2026 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI 2026)

August 03 - 07, 2026 | Dallas, Texas, USA

The 2026 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI 2026) is a premier international symposium focused on electromagnetic compatibility, signal integrity and power integrity technologies. The symposium brings together researchers, engineers, industry professionals and experts to present innovative research, practical solutions and emerging developments in EMC, high-speed systems, signal integrity, power integrity, wireless technologies and related engineering applications.

Topics of interest include but are not limited to, the following

• Electromagnetic Compatibility (EMC)
• Signal Integrity and Power Integrity
• High Speed Digital Systems
• Power Distribution Networks
• Electromagnetic Interference and Mitigation
• EMC Testing and Measurement Techniques
• Antennas and Wireless Technologies
• RF and Microwave Systems
• Electromagnetic Modeling and Simulation
• PCB Design and Analysis
• System Level EMC Design
• Automotive EMC
• Aerospace and Defense EMC
• 5G/6G and Wireless Communication Systems
• Artificial Intelligence and Machine Learning for EMC
• Standards, Regulations and Compliance

Paper Submission:

Authors are invited to submit original research papers through the EMC+SIPI 2026 submission system. Submitted papers must not have been previously published or under consideration elsewhere.

Submission Link : EMC+SIPI 2026 Submission System

Important Dates :

Publication

Accepted papers will be included in the IEEE EMC+SIPI 2026 symposium proceedings and submitted for inclusion in IEEE Xplore Digital Library.

Contact Us

For IEEE EMC+SIPI 2026 inquiries related to conference information, paper submission details, registration, participation and other conference-related queries, please contact the organizing team.

• IEEE EMC+SIPI 2026 Organizing Team
• Website : https://2026.emcsipi.org/